Yuefeng Technology has conducted business exchanges with Intel and plans to jointly explore heat dissipation solutions
December 29, 2025
On December 27th, a delegation of experts from the global semiconductor company Intel visited Yuefeng Technology. Both sides had in-depth exchanges on heat dissipation technology and high-power computing infrastructure, and reached a high degree of consensus on technical paths, application scenarios, and cooperation models, forming a clear initial cooperation intention.
Through this exchange, both sides have a significant intersection in terms of future cooperation directions, and it also marks that Yuefeng Technology's strategic layout in the global heat dissipation and AI computing power infrastructure field has entered a new stage. This is not only an important achievement of the company's firm commitment to the development strategy of "industrial diversification and business globalization", but also will strongly promote Yuefeng Technology to build a key component platform for liquid cooling of high-power AI servers for the future, continuously enhancing its core competitiveness in the global manufacturing system.
